DATE is pleased to present a special hybrid format for its 2022 event, as the situation related to COVID-19 is improving but safety measures and restrictions will remain uncertain for the upcoming months across Europe and worldwide. In transition towards a future post-pandemic event again, DATE 2022 will host a two-day live event in presence in the city of Antwerp (just north of Brussels in Belgium), to bring the community together again, followed by other activities carried out entirely online in the subsequent days. This setup combines the in-presence experience with the opportunities of on-line activities, fostering the networking and social interactions around an interesting program of selected talks and panels on emerging topics to complement the traditional DATE high-quality scientific, technical and educational activities.

ET6.8.3 Connecting Design, Manufacturing and Assembly in the Moore’s Law 2.0 Era

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Paul Cohen, SEMI/ESDA, United States

As device scaling predicted by Moore’s Law becomes more difficult and costly, designers are looking towards new solutions to deliver increasing system level functionality and performance along with lower power and cost. The International Technology Roadmap for Semiconductors (ITRS) served as a designer’s guide to upcoming technologies for many years until it’s retirement in 2016. The Heterogeneous Integration Roadmap (HIR) provides a new guideline for system level integration for the coming decades. This includes new technologies which will have an impact on the tradeoffs facing designers. In addition, the increasing use of silicon in products and applications with long lifetimes and critical safety requirements suggests that long term process effects can no longer be safely ignored. All of this requires increased communication amongst all aspects of system design, manufacture, and assembly as we move towards Moore 2.0.